Intel to use high-k metal instead of silicon

Intel to use high-k metal instead of silicon

Robert B. Crooke, VP&GM, business client group, IntelIntel talks about the breakthrough in semicon technology

Thursday, October 25, 2007

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Intel will be unveiling a new set of chips-platform early next year, which will see a breakthrough in semiconductor technology. The chips, for the first time will be using metal, instead of silicon, and will have embedded features such as security, and better manageability.

Robert B. Crooke, vice president and general manager, business client group, Intel, spoke to R. Jai Krishna of CyberMedia News about this aspect and mobile Internet devices, which will see new form factors coming in the market: Excerpts:

CMN: Can you tell us about the new platform which Intel is now building?

Robert B. Crooke: We developed the VPro platform a year ago and have now ramped up the capability of the platform for desktops and notebooks. The new platform will have built-in manageability, proactive technology, network operation and energy efficiency features. We have made this possible by making changes both at the micro and macro level.

At the micro level, we have concentrated on semiconductor components and at PC system level at the macro-level . For example, the technology enables IT guys to manage the system better by turning on the computer remotely, pushing a patch for update and then again putting it back to sleep.

CMN: How will this new technology be different from the earlier ones?

RBC: We have new platforms being rolled out every summer for desktops for business. The new technology will see 20-30 percent increase in performance and will be lesser power consuming. This will be the first time that such a technology is being made possible through semiconductor processes coming on 45nm technology. It will be the biggest advancement in semiconductor technology in 20 years. The technology works on fundamentals of the transfer, new type of material for high-K metal gate processes. It will save wasted power, as metal components will be used instead of the traditional silicon.

There will be new features such as security technology with data encryption, network administration, push encryption in hardware and collaborate it with software. Hence, there will be no software-based attacks, and enables better manageability of hardware.

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