MIGDAL HA'EMEK, ISRAEL: Jordan Valley Semiconductors Ltd, a provider of semiconductor metrology solutions, announced that TSMC has selected JVX 6200 X-ray metrology tool for measuring the thickness of thin film copper layers in TSMC.

The evaluation of potential technologies: X-ray vs. opto-acoustic, "We found that X-ray reflectometry (XRR) demonstrated the required capability. Among the evaluated X-ray based tools, the JVX 6200 for its superior precision in the sub-angstrom range and for its lower total cost of ownership," Isaac Mazor, Jordan Valley's President and CEO commented.

"We are pleased and proud with the outcome of this evaluation. We see TSMC not only as a valued strategic customer, but also as a technological leader. TSMC's decision is recognition of XRR as the technology-of-choice for copper layer thickness metrology in our products. We are looking forward to continue supporting their metrology needs as they evolve."

X-ray reflectometry
X-ray reflectometry is a no-contact, non-distractive, surface-sensitive technique that delivers precise and accurate characterization and metrology of thin films and multi-layer stacks. The technique delivers thickness, density and roughness data by analyzing the reflection vs. angle, and interference patterns of X-rays that reflect off the interfaces.

XRR is capable of analyzing single and multiple thin films layers from 1 to 500 nm thick. Jordan Valley's advanced XRR technology allows measurements on production wafers and offers superior throughput of over 30 WPH (17 points on 300mm wafer).